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OUR   Solutions

Front End Process, Metrology and Inspection, Backend and Advanced Packaging, Test and Measurement and Failure Analysis/Reliability Equipment for Semiconductor Fabs, R&D Facilities, Military/Defense and Universities

MPI Corporation

  • Manual, Automatic and Production Probe Stations

  • DC, RF, Photonic, MEMS, High Power

  • Positioners & Probe Accessories

  • RF Probes, Calibration Substrates, Calibration Software

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MPI Thermal

Evolution in Temperature Forcing Systems

 

​Business Segments:

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  • Semiconductor

  • ​Aerospace/Defense

  • Automotive

  • Electronic Test

  • Fiber Optics

  • Sensors

  • Telecommunications

  • Advanced Technology

tOTAL tEMP

The primary goal for TotalTemp is to maximize the combined 40 years of experience we have in this highly specialized field and create a new, alternative, “Next Generation” Temperature Chambers and Temperature Testing equipment.
 

Our Mission is to offer thermal testing equipment that best suits our customers’ requirements. For several decades there were only two real manufacturers for thermal platforms.
 

It was no secret that the market demanded a new alternative with better service and lower costs. We heard you loud and clear and TotalTemp is here to fill that need.

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Spectrum

  • A/D, Digitizer, Transient Recorder

  • D/A Arbitrary Waveform Generator

  • Hybrid:  Digitizer AWG

  • Digital I/O Cards and Pattern Generators

  • SBench-6 Instrumentation Software

  • Accessories to include: Cables, A/D External Pre-Amplifiers, D/A Amplifier Card, Clock and Trigger Distribution, Docking Stations

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Gel-Pak

Automated Die Handling

  • Damage Free Shipping and Handling

  • Pocketless Waffle Pack and Carriers

  • Textured Universal Carriers

  • Available in 2",4" & JEDEC Sizes

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Gel-Probe Refine and Remove​

  • Probe Card Cleaning and Polishing Sheets/Wafers

  • Extend Probe Card Life

  • Increases Uptime, Throughput, and Yield

  • Supported in-partnership with ESWest​

Tresky

Die Bonding

 

  • Flip-Chip

  • RFID

  • Copper Pillar

  • Thermosonic Flip-Chip

  • Sinter

  • Manual and Semi-Automated Die Bonder

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IpTest

Fastest Wide Bandgap Testers​

 

  • Power Discrete MOS

  • IGBT

  • SiC

  • GaN

  • Bipolar Devices​

Invacu

Vacuum Reflow Soldering Ovens​

 

  • Designed for Production and R&D

  • Fluxless Formic Acid Technology

  • Void Free Die Attach

  • Programmable 

Pink

We Build Systems.  We are PINK​

 

  • Vacuum Soldering Systems

  • Sintering Systems

  • Drying Systems/Isolators

  • ​Low Pressure Plasma Systems​

Test Tool Solutions Group

  • Test Sockets, CMOS Censors, WLCSP Socket, PoP Socket

  • Pogo Pins

  • Hand Socket Lid

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Applications​

  • Die Bonding

  • Wedge-Wedge

  • Ball-Wedge

  • Ribbon

  • Bumps

  • Heavy Wire

  • Battery

  • Copper

  • Coated

  • Insulated

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