Our Solutions
Front End Process, Metrology and Inspection, Backend and Advanced Packaging, Test and Measurement and Failure Analysis/Reliability Equipment for Semiconductor Fabs, R&D Facilities, Military/Defense and Universities
-
Manual, Automatic and Production Probe Stations
-
DC, RF, Photonic, MEMS, High Power
-
Positioners & Probe Accessories
-
RF Probes, Calibration Substrates, Calibration Software
Evolution in Temperature Forcing Systems
​
​Business Segments:
​
-
Semiconductor
-
Aerospace/Defense
-
Automotive
-
Electronic Test
-
Fiber Optics
-
Sensors
-
Telecommunications
-
Advanced Technology
.jpg)
-
A/D, Digitizer, Transient Recorder
-
D/A Arbitrary Waveform Generator
-
Hybrid: Digitizer AWG
-
Digital I/O Cards and Pattern Generators
-
SBench-6 Instrumentation Software
-
Accessories to include: Cables, A/D External Pre-Amplifiers, D/A Amplifier Card, Clock and Trigger Distribution, Docking Stations
Automated Die Handling
-
Damage Free Shipping and Handling
-
Pocketless Waffle Pack and Carriers
-
Textured Universal Carriers
-
Available in 2", 4" & JEDEC Sizes
Gel-Probe Refine and Remove​
-
Probe Card Cleaning and Polishing Sheets/Wafers
-
Extend Probe Card Life
-
Increases Uptime, Throughput, and Yield
-
Supported in-partnership with ESWest
Die Bonding
-
Flip-Chip
-
RFID
-
Copper Pillar
-
Thermosonic Flip-Chip
-
Sinter
-
Manual and Semi-Automated Die Bonder
Fastest Wide Bandgap Testers​
​
-
Power Discrete MOS
-
IGBT
-
SiC
-
GaN
-
Bipolar Devices
Vacuum Reflow Soldering Ovens​
-
Designed for Production and R&D
-
Fluxless Formic Acid Technology
-
Void Free Die Attach
-
Programmable
We Build Systems. We are PINK​
-
Vacuum Soldering Systems
-
Sintering Systems
-
Drying Systems/Isolators
-
Low Pressure Plasma Systems
-
Test Sockets, CMOS Censors, WLCSP Socket, PoP Socket
-
Pogo Pins
-
Hand Socket Lid
Applications​
​
-
Die Bonding
-
Wedge-Wedge
-
Ball-Wedge
-
Ribbon
-
Bumps
-
Heavy Wire
-
Battery
-
Copper
-
Coated
-
Insulated
