Our Solutions
Front End Process, Metrology and Inspection, Backend and Advanced Packaging, Test and Measurement and Failure Analysis/Reliability Equipment for Semiconductor Fabs, R&D Facilities, Military/Defense and Universities
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Manual, Automatic and Production Probe Stations
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DC, RF, Photonic, MEMS, High Power
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Positioners & Probe Accessories
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RF Probes, Calibration Substrates, Calibration Software
Evolution in Temperature Forcing Systems
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​Business Segments:
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Semiconductor
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Aerospace/Defense
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Automotive
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Electronic Test
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Fiber Optics
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Sensors
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Telecommunications
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Advanced Technology
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A/D, Digitizer, Transient Recorder
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D/A Arbitrary Waveform Generator
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Hybrid: Digitizer AWG
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Digital I/O Cards and Pattern Generators
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SBench-6 Instrumentation Software
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Accessories to include: Cables, A/D External Pre-Amplifiers, D/A Amplifier Card, Clock and Trigger Distribution, Docking Stations
Thermal Wafer Test Technology​
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Ultra Low Noise & Low Leakage
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Wide Temperature Range from -65 °C to +400 °C
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Temperature Accuracy: ±0.08 °C
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Temperature Uniformity: > 200 °C < ±0.5 %-60 °C to +200 °C < ±0.5 °C | > 200 °C < ±0.5%
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Lowest Soak Time, Lowest CDA Consumption
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Robust, Long Life, and Low Cost of Ownership
Die Bonding
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Flip-Chip
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RFID
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Copper Pillar
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Thermosonic Flip-Chip
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Sinter
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Manual and Semi-Automated Die Bonder
Fastest Wide Bandgap Testers​
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Power Discrete MOS
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IGBT
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SiC
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GaN
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Bipolar Devices
Vacuum Reflow Soldering Ovens​
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Designed for Production and R&D
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Fluxless Formic Acid Technology
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Void Free Die Attach
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Programmable
We Build Systems. We are PINK​
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Vacuum Soldering Systems
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Sintering Systems
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Drying Systems/Isolators
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Low Pressure Plasma Systems
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Test Sockets, CMOS Censors, WLCSP Socket, PoP Socket
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Pogo Pins
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Hand Socket Lid
Applications​
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Die Bonding
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Wedge-Wedge
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Ball-Wedge
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Ribbon
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Bumps
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Heavy Wire
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Battery
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Copper
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Coated
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Insulated